EETimes – GUC Die-to-Die (D2D) Total Solution Opening the New Era of Flagship SoC –

Global Unichip Corp. (GUC), the Advanced ASIC Leader, disclosed today that it has successfully demonstrated the silicon-proven GLink (GUC multi-die

Source: EETimes – GUC Die-to-Die (D2D) Total Solution Opening the New Era of Flagship SoC –